Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP)— 14 стр.
Fibre optic communication subsystem basic test procedures - Part 1-3: Test procedures for general communication subsystems - Central wavelength and spectral width measurement— 29 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing— 28 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)— 91 стр.
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases— 0 стр.
Fibre optic active components and devices. Package and interface standards. 40-Gbit/s serial transmitter and receiver components for use with the LC connector interface— 38 стр.
