Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 42 стр.
Environmental testing. Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method— 58 стр.
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 75 стр.
International Electrotechnical Vocabulary - Part 561: Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection— 302 стр.
Electromagnetic compatibility (EMC). Testing and measurement techniques. Test methods for protective devices for HEMP and other radiated disturbances— 100 стр.