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BS EN 62739-1:2013

Действует
Test method for erosion of wave soldering equipment using molten lead-free solder alloy. Erosion test method for metal materials without surface processing — 20 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 60068-2-20:2008 ed5.0
Заменен
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads — 40 стр.
BS EN 60068-2-20:2008
Действует
Environmental testing. Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads — 22 стр.
IEC 61190-1-3:2007 ed2.0
Заменен
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications — 71 стр.
BS EN 61190-1-3:2007
Действует
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications — 38 стр.
IEC 60194:2006 ed5.0
Заменен
Printed board design, manufacture and assembly - Terms and definitions — 118 стр.
ISO 16143-1:2004
Заменен
Stainless steels for general purposes -- Part 1: Flat products — 28 стр.
ISO 16143-2:2004
Заменен
Stainless steels for general purposes -- Part 2: Semi-finished products, bars, rods and sections — 30 стр.
ISO 16143-3:2005
Заменен
Stainless steels for general purposes -- Part 3: Wire — 20 стр.

На этот документ ссылаются

BS EN 62739-3:2017
Действует
Test method for erosion of wave soldering equipment using molten lead-free solder alloy. Selection guidance of erosion test methods — 36 стр.
BS EN 62739-2:2016
Действует
Test method for erosion of wave soldering equipment using molten lead-free solder alloy. Erosion test method for metal materials with surface processing — 22 стр.