Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections. Ceramic enclosures— 90 стр.
Composite station post insulators for substations with a.c. voltages greater than 1000 V up to 245 kV. Definitions, test methods and acceptance criteria— 40 стр.
Composite hollow insulators. Pressurized and unpressurized insulators for use in electrical equipment with rated voltage greater than 1000 V. Definitions, test methods, acceptance criteria and design recommendations— 44 стр.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 42 стр.
Organic coating systems and linings for protection of industrial apparatus and plants against corrosion caused by aggressive media. Combined linings with tile and brick layers— 56 стр.
Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections. Ceramic enclosures— 90 стр.
Fibre optic active components and devices. Package and interface standards. Transmitter and receiver components for use with LC connector interface— 36 стр.
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009) (english version)
