Specification for harmonized system of quality assessment for electronic components. Semiconductor discrete devices. Blank detail specification. Bidirectional triode thyristors (triacs), ambient or case-rated, up to 100 A— 16 стр.
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides (IEC 61188-5-6:2003); German version EN 61188-5-6:2003— 21 стр.
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007); German version EN 61188-5-8:2008— 31 стр.
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of form E and G (IEC 60286-4:1997); German version EN 60286-4:1998— 12 стр.
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:1997); German version EN 60286-3:1998— 19 стр.
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011— 20 стр.
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007— 15 стр.
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999— 46 стр.
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009— 40 стр.
Liquid crystal and solid-state display devices - Part 1: Generic specification (IEC 61747-1:1998 + A1:2003); German version EN 61747-1:1999 + A1:2003— 45 стр.
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides (IEC 61188-5-3:2007); German version EN 61188-5-3:2007— 31 стр.
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 61188-5-5:2007); German version EN 61188-5-5:2007— 46 стр.
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms— 8 стр.
Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits (IEC 60747-16-10:2004); German version EN 60747-16-10:2004— 56 стр.
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms (IEC 60286-4:2013); German version EN 60286-4:2013— 18 стр.
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007); German version EN 61188-5-4:2007— 17 стр.
Fiber optic active components and devices - Package and interface standards - Part 17: Transmitter and receiver components with dual coaxial RF connectors (IEC 62148-17:2013); German version EN 62148-17:2014— 17 стр.
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 60191-6-13:2007); German version EN 60191-6-13:2007— 16 стр.
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016— 20 стр.
Printed boards and printed board assemblies. Design and use. Attachment (land/joint) considerations. Components with gull- wing leads on four sides— 46 стр.
Connectors for frequencies below 3 MHz for use with printed boards. Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits— 30 стр.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 16 стр.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 42 стр.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP)— 14 стр.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine pitch land grid array (FLGA)— 16 стр.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages— 14 стр.
Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)— 22 стр.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)— 24 стр.
BS EN 62149-11. Fibre optic active components and devices. Performance standards. Part 11. Multiple channel transmitter/receiver chip scale package with multimode fibre interface— 16 стр.
Fibre optic active components and devices. Package and interface standards. 40-Gbit/s serial transmitter and receiver components for use with the LC connector interface— 38 стр.
Fibre optic active components and devices. Package and interface standards. Transmitter and receiver components with dual coaxial RF connectors— 18 стр.
Fibre optic active components and devices. Package and interface standards. Transmitter and receiver components for use with LC connector interface— 36 стр.
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2007); German version EN 60191-1:2007— 39 стр.
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018— 41 стр.
