Sampling procedures for inspection by attributes. Part 1. Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection— 94 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing— 28 стр.
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste— 76 стр.
Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors, General and classification, Sensor generals and classification for semiconductor sensors— 14 стр.
BS EN 60747-18-2. Semiconductor devices. Part 18-2. Semiconductor bio sensors. Evaluation process of lens-free CMOS photonic array sensor package module— 19 стр.
Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors, General and classification, Sensor generals and classification for semiconductor sensors— 14 стр.
