Sampling procedures for inspection by attributes. Part 1. Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection— 94 стр.
Amendment 1 - Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits— 5 стр.
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste— 76 стр.
