PD IEC/TR 60068-3-12:2014

Действует

Environmental testing. Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile — 20 стр.

Описание Изменения Ссылки Версии

Ссылочные документы

IEC 60068-2-58:2015 ed4.0

Действует

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 75 стр.

IEC 60584-2:1982/AMD1:1989 ed1.0

Заменен

Amendment 1 - Thermocouples. Part 2: Tolerances — 5 стр.

PD IEC/TR 60068-3-12:2007

Заменен

Environmental testing. Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile — 20 стр.