Liquid crystal display devices - Part 10-1: Environmental, endurance and mechanical test methods - Mechanical (IEC 61747-10-1:2013); German version EN 61747-10-1:2013— 14 стр.
Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors, General and classification, Sensor generals and classification for semiconductor sensors— 14 стр.
Electrical engineering; basic environmental testing procedures; tests; test N: change of temperature; identical with IEC 60068-2-14, edition 1984 (status as of 1986)
Semiconductor devices; integrated circuits; part 20: generic specification for film integrated circuits and hybrid film integrated circuits; identical with IEC 60748-20:1988
Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification, Internal visual inspection and special tests— 100 стр.
Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification. Manufacturers' self-audit checklist and report— 88 стр.
Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification. Procedure for qualification approval— 32 стр.
Electrical engineering; basic environmental testing procedures; tests; test U: robustness of terminations and integral mounting devices; identical with IEC 60068-2-21, edition 1983
Electrical engineering; basic environmental testing procedures; test Db and guidance: damp heat, cyclic (12 + 12-hour cycle); identical with IEC 60068-2-30, edition 1980 (status as of 1985)
Electrotechnic; basic environmental testing procedures; mounting of components, equipment and other articles for dynamic tests including shock (Ea), bump (Eb),vibration (Fc and Fd) and steady-state acceleration (Ga) and guidance; identical with IEC 60068-2-47, edition 1982
Electrical engineering; basic environmental testing procedures; guidance to tests Z/AFc and Z/BFc: combined temperature (cold and dry heat) and vibration (sinusoidal) tests; identical with IEC 60068-2-53, edition 1984
Electrical engineering; environmental testing; test Td: solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD); identical with IEC 60068-2-58:1989
Environmental Testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste (IEC 91/682/CD:2007)
First supplement to publication 60068-3-1 (1974): basic environmental testing procedures; part 3: background information, section one - cold and dry heat tests
Electrical engineering; basis environmental testing procedures; test Fc and guidance: vibration (sinusoidal); identical with IEC 60068-2-6:1982 (status as of 1985)
Electrical engineering; basic environmental testing procedures; test Ga and guidance: acceleration, staedy state; identical with IEC 60068-2-7:1983 (status as of 1986)
Semiconductor devices - Part 3: Signal diodes and regulator diodes; Section two: Blank detail specification for voltage-regulator diodes and voltage reference diodes; Identical with IEC 60747-3-2:1986
Semiconductor devices - Part 6: Thyristors; Section two: Blank detail specification for bidirectional triode thyristors (triacs), ambient or case-rated, up to 100 A; Identical with IEC 60747-6-2:1991
Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods (IEC 61747-5:1998); German version EN 61747-5:1998— 22 стр.
