Base materials for printed circuits - Part 2: Specifications; specification No. 8: Flexible copper-clad polyester (PETP) film (IEC 60249-2-8:1987 + A1:1993); German version EN 60249-2-8:1994 + A1:1994— 10 стр.
Metal-clad base materials for printed circuits; special materials; specification no. 2; copper foil for use in the manufacture of copper-clad base materials; identical with IEC 60249-3A; edition 1976 (status as of 1980)
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); transfer adhesive films (IEC 61249-3-5:1999); German version EN 61249-3-5:1999— 14 стр.