Base materials for printed circuits; special materials; specification no. 1: prepreg for use as bonding sheet material in the fabrication of multilayer printed boards; identical with IEC 60249-3-1, edition 1981
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (includes Amendment A1:2000) (IEC 61189-2:1997 + A1:2000); German version EN 61189-2:1997 + A1:2000— 87 стр.
