Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering Flux (IEC 91/1070/CD:2012)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015); German version EN 61189-5-2:2015— 44 стр.
