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DIN IEC 60068-2-83:2007-09

Отменен
Environmental Testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste (IEC 91/682/CD:2007)
DIN IEC 60068-2-83:2007-09
Отменен