Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method (IEC 60068-2-54:2006); German version EN 60068-2-54:2006— 21 стр.
Electrical engineering; environmental testing; test Td: solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD); identical with IEC 60068-2-58:1989
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 91/809/CD:2008)
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly— 41 стр.
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method— 110 стр.
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (IEC 60068-2-69:2007); German version EN 60068-2-69:2007— 27 стр.
Air quality - Certification of automated measuring systems - Part 3: Performance criteria and test procedures for automated measuring systems for monitoring emissions from stationary sources; German version EN 15267-3:2007— 64 стр.
Fixed resistors for use in electronic equipment - Part 1: Generic specification (IEC 60115-1:2008, modified); German version EN 60115-1:2011 + A11:2015— 92 стр.
Maritime navigation and radiocommunication equipment and systems - General requirements - Methods of testing and required test results (IEC 60945:2002); German version EN 60945:2002— 88 стр.
Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013); German version EN ISO 9455-16:2013— 26 стр.
