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DIN EN 61189-5-3:2015-11

Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015); German version EN 61189-5-3:2015 — 45 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

DIN EN ISO 9455-2:1995-11
Действует
Soft soldering fluxes - Test methods - Part 2: Determination of non-volatile matter, ebulliometric method (ISO 9455-2:1993); German version EN ISO 9455-2:1995 — 8 стр.
DIN EN ISO 9455-16:2013-08
Отменен
Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013); German version EN ISO 9455-16:2013 — 26 стр.
DIN EN ISO 9001:2015-11
Действует
Quality management systems - Requirements (ISO 9001:2015); German and English version EN ISO 9001:2015 — 71 стр.
DIN ISO 5725-2:2002-12
Отменен
Accuracy (trueness and precision) of measurement methods and results - Part 2: Basic method for the determination of repeatability and reproducibility of a standard measurement method (ISO 5725-2:1994 including Technical Corrigendum 1:2002) — 97 стр.
DIN IEC 62137-3:2009-10
Отменен
Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints (IEC 91/876/CD:2009)
IEC 61249-2-7:2002 ed1.0
Действует
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad — 41 стр.
DIN IEC 61190-1-3/A1:2008-11
Отменен
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 91/809/CD:2008)
IEC 61190-1-2:2014 ed3.0
Действует
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly — 46 стр.
IEC 61190-1-1:2002 ed1.0
Действует
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly — 41 стр.
IEC 61189-6:2006 ed1.0
Отменен
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies — 83 стр.
BS IEC 61189-5-4:2015
Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies — 26 стр.
IEC 61189-3:2007 ed2.0
Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) — 241 стр.
IEC 61189-2:2006 ed2.0
Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures — 122 стр.
DIN IEC 61189-11:2009-11
Отменен
Test methods for electrical materials, interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys (IEC 91/879/CD:2009)
DIN IEC 60068-2-20:1991-04
Отменен
Electrical engineering; basic environmental testing procedures; test T: soldering; identical with IEC 60068-2-20:1979 (status as of 1987)
DIN IEC 60068-1:1990-11
Отменен
Electrical engineering; basic environmental testing procedures; general and guidance; identical with IEC 60068-1:1988
ASTM D1210-96
Заменен
Standard Test Method for Fineness of Dispersion of Pigment-Vehicle Systems by Hegman-Type Gage — 11 стр.
ASTM B36/B36M-95
Заменен
Standard Specification for Brass Plate, Sheet, Strip, And Rolled Bar — 6 стр.
DIN EN 61189-5-3:2013-07
Отменен
Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste (IEC 91/1071/CD:2012)
DIN EN 61189-5:2007-05
Действует
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 61189-5:2006); German version EN 61189-5:2006 — 65 стр.