Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003— 19 стр.
Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996 + A1:2000 + A2:2001); German version EN 60749:1999 + A1:2000 + A2:2001— 74 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003— 10 стр.
Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996 + A1:2000 + A2:2001); German version EN 60749:1999 + A1:2000 + A2:2001— 74 стр.