DIN EN 60191-6-19:2010-10

Действует

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010 — 15 стр.

Описание Изменения Ссылки Версии

Ссылочные документы

DIN IEC 60191-6-5:2010-01

Отменен

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 47D/755/CD:2009)

DIN IEC 60749-20-1:2005-02

Отменен

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling, shipping and use of moisture/reflow sensitive surface mount devices (IEC 47/1775/CD:2004)