Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections; sectional specification (IEC 62326-4:1996); German version EN 62326-4:1997— 31 стр.
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings; section 1: Copper foils (for the manufacturer of copper-clad base materials) (IEC 61249-5-1:1995); German version EN 61249-5-1:1996— 10 стр.
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections; sectional specification; section 1: Capability detail specification; performance levels A, B and C (IEC 62326-4-1:1996); German version EN 62326-4-1:1997— 59 стр.
Rules of procedure of the IEC Quality Assessment System for electronic components (IECQ) - Part 2: Documentation; technology Approval Schedules (IEC QC 001002-2:1995)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:2007); German version EN 61189-3:2008— 120 стр.
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:1997 + A1:1999); German version EN 61189-3:1997 + A1:1999— 67 стр.
Solderless connections - Part 5: Press-in connections; General requirements, test methods and practical guidance (IEC 60352-5:2001); German version EN 60352-5:2001— 38 стр.
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections; sectional specification; section 1: Capability detail specification; performance levels A, B and C (IEC 62326-4-1:1996); German version EN 62326-4-1:1997— 59 стр.