Semiconductor devices - Micro electro mechanical devices - Part 13: Bend- and shear- test methods of measuring adhesive strength for MEMS structures (IEC 47F/44/CD:2010)
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012— 17 стр.
