DIN EN 60191-3:2000-07

Действует

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999 — 46 стр.

Описание Изменения Ссылки Версии

Ссылочные документы

DIN IEC 60191-4:1992-08

Отменен

Semiconductor devices; coding system for packages and classification into forms of package outlines; identical with IEC 60191-4:1987

DIN ISO 1101 Beiblatt 1:1992-11

Отменен

Technical drawings; geometrical tolerancing; characteristics and symbols; examples of indication and interpretation — 3 стр.

DIN ISO 2692:1990-05

Отменен

Technical drawings; geometrical tolerancing; maximum material principle; identical with ISO 2692:1988 — 23 стр.

DIN EN 60191-4:2003-03

Отменен

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001 + A2:2002); German version EN 60191-4:1999 + A1:2002 + A2:2002 — 24 стр.

BS IEC 60191-1:2007

Заменен

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of discrete devices — 40 стр.

BS IEC 60191-2:1966

Действует

Mechanical standardization of semiconductor devices. Dimensions — 1052 стр.

DIN EN ISO 2692:2007-04

Отменен

Geometrical product specifications (GPS) - Geometrical tolerancing - Maximum material requirement (MMR), least material requirement (LMR) and reciprocity requirement (RPR) (ISO 2692:2006); German version EN ISO 2692:2006 — 47 стр.