Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:1998); German version EN 61760-1:1998— 18 стр.
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003); German version EN 61188-5-2:2003— 53 стр.
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2006); German version EN 61760-1:2006— 31 стр.
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of form E and G (IEC 60286-4:1997); German version EN 60286-4:1998— 12 стр.
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide (IEC 61760-2:2007); German version EN 61760-2:2007— 12 стр.
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010); German version EN 61760-3:2010— 26 стр.
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide (IEC 61760-2:1998); German version EN 61760-2:1998— 5 стр.
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007); German version EN 61188-5-4:2007— 17 стр.
Product package labels for electronic components using bar code and two-dimensional symbologies (IEC 62090:2002); German version EN 62090:2003— 44 стр.
