Base materials for printed circuits; specifications; specification No. 13: flexible copper-clad polyimide film, general purpose grade; identical with IEC 60249-2-13:1987
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); transfer adhesive films (IEC 61249-3-5:1999); German version EN 61249-3-5:1999— 14 стр.
Base materials for printed circuits - Part 2: Specifications; specification No. 13: Flexible copper-clad polyimide film, general purpose grade (IEC 60249-2-13:1987 + A1:1993); German version EN 60249-2-13:1994 + A1:1994— 10 стр.
