DIN EN 60191-6-20:2011-03

Действует

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010 — 14 стр.

Описание Изменения Ссылки Версии

Ссылочные документы

DIN IEC 60191-4:2010-07

Отменен

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/769/CD:2010)

DIN IEC 60191-6-1:2010-07

Отменен

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals (IEC 47D/770/CD:2010)