Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (IEC 61760-4:2015 + A1:2018); German version EN 61760-4:2015 + A1:2018— 38 стр.
Electrical engineering; environmental testing; test Td: solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD); identical with IEC 60068-2-58:1989
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling, shipping and use of moisture/reflow sensitive surface mount devices (IEC 47/1775/CD:2004)
Sampling procedures for inspection by attributes - Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection (ISO 2859-1:1999 + Cor. 1:2001 + Amd.1:2011); Text in German and English— 195 стр.
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (IEC 61760-4:2015); German version EN 61760-4:2015— 34 стр.
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (IEC 91/1419/CDV:2017); German version EN 61760-4:2015/prA1:2017
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (IEC 61760-4:2015); German version EN 61760-4:2015— 34 стр.
