DIN EN 62739-1:2014-02

Действует

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (IEC 62739-1:2013); German version EN 62739-1:2013 — 19 стр.

Описание Изменения Ссылки Версии

Ссылочные документы

DIN IEC 60068-2-20:1991-04

Отменен

Electrical engineering; basic environmental testing procedures; test T: soldering; identical with IEC 60068-2-20:1979 (status as of 1987)

DIN IEC 60194:1992-11

Отменен

Printed circuits; terms and definition; identical with IEC 60194:1988

DIN IEC 61190-1-3/A1:2008-11

Отменен

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 91/809/CD:2008)

DIN EN 62739-1:2011-11

Отменен

Test method for erosion of wave soldering equipments by molten lead free solder alloy - Part 1: Erosion test method for the metallic material without surface treatment (IEC 91/987/CD:2011)