Base materials for printed circuits - Part 2: Specifications; Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards (IEC 60249-2-11:1987 + A1:1989 + A2:1993 + A3:1994 + A4:2000); German version EN 60249-2-11:1994 + A2:1994 + A3:1995 + A4:2000— 16 стр.
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); transfer adhesive films (IEC 61249-3-5:1999); German version EN 61249-3-5:1999— 14 стр.
Base materials for printed circuits - Part 2: Specifications; Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet, of defined flammabilty, for use in the fabrication of multilayer printed boards (IEC 60249-2-12:1987 + A1:1989 + A2:1993 + A3:1994 + A4:2000); German version EN 60249-2-12:1994 + A2:1994 + A3:1995 + A4:2000— 15 стр.
Base materials for printed circuits - Part 2: Specifications; Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board (IEC 60249-2-17:1992 + A1:1993 + A2:1994 + A3:2000); German version EN 60249-2-17:1993 + A1:1994 + A2:1995 + A3:2000— 17 стр.
Base materials for printed circuits; part 2: specifications; specification No. 19: thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards (IEC 60249-2-19:1992); German version EN 60249-2-19:1993— 9 стр.
Base materials for printed circuits - Part 2: Specifications; Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards (IEC 60249-2-19:1992/A2:1994); German version EN 60249-2-19:1993/A2:1995— 3 стр.
Base materials for printed circuits - Part 2: Specifications; specification No. 13: Flexible copper-clad polyimide film, general purpose grade (IEC 60249-2-13:1987 + A1:1993); German version EN 60249-2-13:1994 + A1:1994— 10 стр.
Base materials for printed circuits - Part 2: Specifications; specification No. 8: Flexible copper-clad polyester (PETP) film (IEC 60249-2-8:1987 + A1:1993); German version EN 60249-2-8:1994 + A1:1994— 10 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (includes Amendment A1:2000) (IEC 61189-2:1997 + A1:2000); German version EN 61189-2:1997 + A1:2000— 87 стр.
Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); adhesive coated flexible polyester film (IEC 61249-3-3:1999); German version EN 61249-3-3:1999— 14 стр.
Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials; section 1: Copper/Invar/copper (IEC 61249-7-1:1995); German version EN 61249-7-1:1995— 6 стр.
Base materials for printed circuits - Part 2: Specifications; specification No. 15: Flexible copper-clad polyimide film, of defined flammability (IEC 60249-2-15:1987 + A1:1993); German version EN 60249-2-15:1994 + A1:1994— 10 стр.
