Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 91/1056/CD:2012)
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015— 44 стр.
