DIN IEC 60749:1987-09

Отменен

Semiconductor devices; mechanical and climatic test methods; identical with IEC 60749, edition 1984

На этот документ ссылаются

DIN EN 61760-2:1998-11

Отменен

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide (IEC 61760-2:1998); German version EN 61760-2:1998 — 5 стр.

DIN EN 61810-7:2007-02

Действует

Electromechanical elementary relays - Part 7: Test and measurement procedures (IEC 61810-7:2006); German version EN 61810-7:2006 — 92 стр.

DIN EN 61192-4:2003-11

Действует

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies (IEC 61192-4:2002); German version EN 61192-4:2003 — 29 стр.

DIN EN 60068-2-58:1999-10

Отменен

Environmental testing - Part 2-58: Tests; test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:1999); German version EN 60068-2-58:1999 — 11 стр.

DIN EN 61760-1:2006-10

Действует

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2006); German version EN 61760-1:2006 — 31 стр.

DIN EN 61751:1998-11

Действует

Laser modules used for telecommunication - Reliability assessment (IEC 61751:1998); German version EN 61751:1998 — 26 стр.

DIN EN 61747-1:2003-12

Действует

Liquid crystal and solid-state display devices - Part 1: Generic specification (IEC 61747-1:1998 + A1:2003); German version EN 61747-1:1999 + A1:2003 — 45 стр.

DIN EN 61964:2000-01

Действует

Integrated circuits - Memory devices pin configurations (IEC 61964:1999); German version EN 61964:1999 — 14 стр.

DIN EN 61747-1:2000-02

Отменен

Liquid crystal and solid-state display devices - Part 1: Generic specification (IEC 61747-1:1998); German version EN 61747-1:1999 — 23 стр.

DIN EN 61747-5:1999-02

Действует

Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods (IEC 61747-5:1998); German version EN 61747-5:1998 — 22 стр.

DIN EN 116000-3:1996-10

Действует

Generic specification - Electromechanical all-or-nothing relays - Part 3: Test and measurement procedures; German version EN 116000-3:1996 — 62 стр.

DIN EN 165000-1:1996-11

Действует

Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure; German version EN 165000-1:1996 — 57 стр.

DIN EN 190109:1996-11

Действует

Family specification - Digital integrated HC MOS circuits - Series HC/HCT/HCU; German version EN 190109:1994 — 32 стр.

DIN EN 190108:1996-11

Действует

Family specification - TTL advanced Schottky digital integrated circuits - Series 54 AS, 74 AS; German version EN 190108:1994 — 11 стр.

DIN EN 190107:1996-11

Действует

Family specification - TTL FAST digital integrated circuits - Series 54 F, 74 F; German version EN 190107:1994 — 11 стр.

DIN EN 190103:1996-11

Действует

Family specification - Digital integrated TTL low power Schottky circuits - Series 54 LS, 64 LS, 74 LS, 84 LS; German version EN 190103:1994 — 16 стр.

DIN EN 190101:1996-11

Действует

Family specification - Digital integrated TTL circuits - Series 54, 64, 74, 84; German version EN 190101:1994 — 13 стр.

DIN EN 190102:1996-11

Действует

Family specification - TTL Schottky digital integrated circuits - Series 54 S, 64 S, 74 S, 84 S; German version EN 190102:1994 — 13 стр.

DIN EN 190000:1996-05

Действует

Generic specification: Monolithic integrated circuits; German version EN 190000:1995 — 267 стр.

DIN EN 190106:1996-11

Действует

Family specification - TTL Advanced Low Power Schottky digital integrated circuits - Series 54 ALS, 74 ALS; German version EN 190106:1994 — 11 стр.

DIN 41794-1:1972-06

Отменен

Reliability details to be given in data sheets; general specification — 4 стр.

DIN IEC 60747-3:1992-04

Отменен

Semiconductor devices; discrete devices; part 3: signal diodes and regulator diodes; identical with IEC 60747-3:1985 — 34 стр.