Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 60749-12:2002); German version EN 60749-12:2002— 7 стр.
Environmental testing -- Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017/COR1:2018) (Corrigendum) (english version)
Electrical engineering; basis environmental testing procedures; test Fc and guidance: vibration (sinusoidal); identical with IEC 60068-2-6:1982 (status as of 1985)
Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 60749-12:2017); German version EN IEC 60749-12:2018— 8 стр.
Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996 + A1:2000 + A2:2001); German version EN 60749:1999 + A1:2000 + A2:2001— 74 стр.
Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996 + A1:2000 + A2:2001); German version EN 60749:1999 + A1:2000 + A2:2001— 74 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 60749-12:2017); German version EN IEC 60749-12:2018— 8 стр.
