Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2006); German version EN 61760-1:2006— 31 стр.
Electrical engineering; basis environmental testing procedures; test Fc and guidance: vibration (sinusoidal); identical with IEC 60068-2-6:1982 (status as of 1985)
Electrical engineering; basic environmental testing procedures; test Ga and guidance: acceleration, staedy state; identical with IEC 60068-2-7:1983 (status as of 1986)
Electrical engineering; basic environmental testing procedures; tests; test N: change of temperature; identical with IEC 60068-2-14, edition 1984 (status as of 1986)
Electrical engineering; basic environmental testing procedures; tests; test U: robustness of terminations and integral mounting devices; identical with IEC 60068-2-21, edition 1983
Electrical engineering; basic environmental testing procedures; test Db and guidance: damp heat, cyclic (12 + 12-hour cycle); identical with IEC 60068-2-30, edition 1980 (status as of 1985)
Electrotechnic; basic environmental testing procedures; mounting of components, equipment and other articles for dynamic tests including shock (Ea), bump (Eb),vibration (Fc and Fd) and steady-state acceleration (Ga) and guidance; identical with IEC 60068-2-47, edition 1982
Basic environmental testing procedures; part 2: tests; guidance on the application of the tests of IEC Publication 60068 to simulate the effects of storage
Electrical engineering; basic environmental testing procedures; guidance to tests Z/AFc and Z/BFc: combined temperature (cold and dry heat) and vibration (sinusoidal) tests; identical with IEC 60068-2-53, edition 1984
Electrical engineering; environmental testing; test Td: solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD); identical with IEC 60068-2-58:1989
First supplement to publication 60068-3-1 (1974): basic environmental testing procedures; part 3: background information, section one - cold and dry heat tests
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:1998); German version EN 61760-1:1998— 18 стр.
Fixed resistors for use in electronic equipment - Part 1: Generic specification (IEC 60115-1:2008, modified); German version EN 60115-1:2011 + A11:2015— 92 стр.
Directly heated negative temperature coefficient thermistors - Part 1: Generic specification (IEC 60539-1:2002); German version EN 60539-1:2002— 48 стр.
Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors (IEC 60115-8:2009, modified); German version EN 60115-8:2012— 45 стр.
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:1998); German version EN 61760-1:1998— 18 стр.
Detail Specification: Fixed low power film resistors - Metal film resistors on high grade ceramic, conformal coated or molded, axial or preformed leads; German version 140101-806:2008 + A1:2013— 39 стр.
Detail specification: Fixed low power film SMD resistors - Cylindrical - Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2; German version EN 140401-803:2007— 39 стр.
Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 0,1; 0,25; 0,5; 1; German version EN 140401-801:2007— 40 стр.
Detail specification: Fixed low power non wire-wound surface mount (SMD) resistors - Rectangular - Stability classes 1; 2; German version EN 140401-802:2002 + A1:2004— 30 стр.
Detail Specification: Fixed low power non wire-wound surface mount (SMD) resistors - Cylindrical - Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2; German version EN 140401-803:2002— 32 стр.
Detail specification: Fixed low power wire-wound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2; German version EN 140402-801:2005— 25 стр.
Detail specification: Fixed low power non wire-wound high stability surface mount (SMD) resistors - Rectangular - Stability classes 0,1; 0,25; German version EN 140401-804:2005— 31 стр.
Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 0,1; 0,25; 0,5; 1; German version EN 140401-801:2007 + A1:2013— 41 стр.
Detail Specification: Fixed low power non wire-wound surface mount (SMD) resistors - Rectangular - Stability classes 0,1; 0,25; 0,5; 1; German version EN 140401-801:2002 + A1:2003— 30 стр.
Detail Specification: Fixed low power non wire-wound surface mount (SMD) resistors - Rectangular - Stability classes 0,1; 0,25; 0,5; 1; German version EN 140401-801:2002— 30 стр.
Detail Specification: Fixed low power non wire-wound surface mount (SMD) resistors - Rectangular - Stability classes 1; 2; German version EN 140401-802:2002— 29 стр.
Detail Specification: Fixed low power non wire-wound surface mount (SMD) resistors - Cylindrical - Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2; German version EN 140401-803:2002 + A1:2003— 33 стр.
Detail Specification: Fixed low power film high stability SMD resistors - Rectangular - Stability classes 0,1; 0,25; German version EN 140401-804:2011 + AC:2011 + AC:2012— 38 стр.
Detail Specification: Fixed low power film resistors - Metal film resistors on high grade ceramic, conformal coated or molded, axial or preformed leads; German version EN 140101-806:2008— 39 стр.
Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2; German version EN 140402-801:2015— 45 стр.
Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 1; 2; German version EN 140401-802:2007 + A1:2010 + A2:2013— 39 стр.
Detail Specification: Fixed low power film high stability SMD resistors - Rectangular - Stability classes 0,1; 0,25; German version EN 140401-804:2011 + A1:2013— 39 стр.
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements (IEC 61188-5-1:2002); German version EN 61188-5-1:2002— 71 стр.
