Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire (IEC 91/1072/CD:2012)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015); German version EN 61189-5-4:2015— 25 стр.
