DIN EN 60249-2-13:1994-09

Отменен

Base materials for printed circuits - Part 2: Specifications; specification No. 13: Flexible copper-clad polyimide film, general purpose grade (IEC 60249-2-13:1987 + A1:1993); German version EN 60249-2-13:1994 + A1:1994 — 10 стр.

Описание Изменения Ссылки Версии

Ссылочные документы

DIN EN 60249-1:1994-05

Отменен

Base materials for printed circuits; part 1: test methods (IEC 60249-1:1982 + A4:1993); German version EN 60249-1:1993 + A4:1994 — 34 стр.

DIN IEC 60249-3A:1986-10

Отменен

Metal-clad base materials for printed circuits; special materials; specification no. 2; copper foil for use in the manufacture of copper-clad base materials; identical with IEC 60249-3A; edition 1976 (status as of 1980)

DIN IEC 60249-1:1986-10

Отменен

Base materials for printed circuits; test methods; identical with IEC 60249-1, edition 1982 (status as of 1984)

DIN IEC 60249-2-13:1989-12

Отменен

Base materials for printed circuits; specifications; specification No. 13: flexible copper-clad polyimide film, general purpose grade; identical with IEC 60249-2-13:1987

На этот документ ссылаются

DIN EN 61249-3-5:1999-11

Действует

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); transfer adhesive films (IEC 61249-3-5:1999); German version EN 61249-3-5:1999 — 14 стр.