DIN EN IEC 61189-2-630:2019-03

Действует

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (IEC 61189-2-630:2018); German version EN IEC 61189-2-630:2018 — 9 стр.

Описание Изменения Ссылки Версии

Ссылочные документы

DIN IEC 60194:1992-11

Отменен

Printed circuits; terms and definition; identical with IEC 60194:1988

DIN EN 61189-2-630:2017-11

Отменен

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for base materials for rigid printed boards - Moisture Absorption after pressure vessel conditioning (IEC 91/1453/CD:2017)