Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010); German version EN 61760-3:2010— 26 стр.
Electrical engineering; basic environmental testing procedures; tests; test N: change of temperature; identical with IEC 60068-2-14, edition 1984 (status as of 1986)
Electrical engineering; basic environmental testing procedures; tests; test U: robustness of terminations and integral mounting devices; identical with IEC 60068-2-21, edition 1983
Electrical engineering; basic environmental testing procedures; test Db and guidance: damp heat, cyclic (12 + 12-hour cycle); identical with IEC 60068-2-30, edition 1980 (status as of 1985)
Electrotechnic; basic environmental testing procedures; mounting of components, equipment and other articles for dynamic tests including shock (Ea), bump (Eb),vibration (Fc and Fd) and steady-state acceleration (Ga) and guidance; identical with IEC 60068-2-47, edition 1982
Electrical engineering; basic environmental testing procedures; guidance to tests Z/AFc and Z/BFc: combined temperature (cold and dry heat) and vibration (sinusoidal) tests; identical with IEC 60068-2-53, edition 1984
Electrical engineering; environmental testing; test Td: solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD); identical with IEC 60068-2-58:1989
First supplement to publication 60068-3-1 (1974): basic environmental testing procedures; part 3: background information, section one - cold and dry heat tests
Electrical engineering; basis environmental testing procedures; test Fc and guidance: vibration (sinusoidal); identical with IEC 60068-2-6:1982 (status as of 1985)
Packaging of components for automatic handling; tape packaging of components with unidirectional leads on continuous tapes; identical with IEC 60286-2, edition 1985
Electrical engineering; basic environmental testing procedures; test Ga and guidance: acceleration, staedy state; identical with IEC 60068-2-7:1983 (status as of 1986)
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling, shipping and use of moisture/reflow sensitive surface mount devices (IEC 47/1775/CD:2004)
