Environmental Testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste (IEC 91/682/CD:2007)
Rules of procedure for the IEC Quality Assessment System for electronic components (IECQ) - Part 3: Approval procedures; technology Approval (IEC QC 001002-3:1995)
Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors (IEC 60115-2:2014, modified); German version EN 60115-2:2015— 71 стр.
Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors (IEC 60115-2:2014, modified); German version EN 60115-2:2015— 71 стр.