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DIN EN IEC 61189-2-807:2020-12

Проект
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA (IEC 91/1647/CD:2020); Text in German and English
ОписаниеИзмененияСсылкиВерсии

На этот документ ссылаются

DIN EN 61191-1:2014-02
Отменен
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2013); German version EN 61191-1:2013 — 51 стр.
DIN EN IEC 61191-1:2019-06
Действует
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018); German version EN IEC 61191-1:2018 — 49 стр.
DIN EN 61191-2:2018-05
Действует
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017 — 36 стр.