Detail Specification: Fixed low power film resistors. Metal film resistors on high grade ceramic, conformal coated or molded, axial or preformed leads— 38 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies— 26 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies— 46 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies— 46 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies— 32 стр.
Metallic and other inorganic coatings. Electrodeposited silver and silver alloy coatings for engineering purposes. Specification and test methods— 28 стр.
Metallic coatings. Electrodeposited gold and gold alloy coatings for electrical, electronic and engineering purposes. Specification and test methods— 34 стр.
BS EN IEC 62025-2. High frequency inductive components. Non-electrical characteristics and measuring methods. Part 2. Test methods for non-electrical characteristics— 28 стр.
BS EN 61643-321 Ed.2.0. Components for low-voltage surge protective devices. Part 321. Performance requirements and test circuits for silicon PN-junction voltage limiters— 27 стр.
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies— 50 стр.
Fixed resistors for use in electronic equipment. Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G— 48 стр.
Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections— 30 стр.