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IEC 60068-2-58:1999 ed2.0

Заменен
Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 17 стр.
Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.
ICS
31.190 Electronic. Including preassembled modules / Электронные компоненты в сборе. Включая предварительно собранные модули
19.040 Environmental. Including testing equipment / Климатические испытания. Включая испытательное оборудование