Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 75 стр.
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 53 стр.
BS EN 60384-22. Fixed capacitors for use in electronic equipment. Part 22. Sectional specification. Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2.— 48 стр.
BS EN 60384-21. Fixed capacitors for use in electronic equipment. Part 21. Sectional specification. Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1— 47 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies— 32 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling— 18 стр.
Printed boards and printed board assemblies. Design and use. Attachment (land/joint) considerations. Components with gull- wing leads on four sides— 46 стр.
Fixed capacitors for use in electronic equipment. Sectional specification. Surface mount fixed tantalum electrolytic capacitors with solid (MnO$d2) electrolyte— 34 стр.
Fixed capacitors for use in electronic equipment. Sectional specification. Fixed aluminium electrolytic surface mount capacitors with solid (MnO$d2) and non-solid electrolyte— 38 стр.
BS IEC 60068-2-82. Environmental testing. Part 2-82. Tests. Test XW1. Whisker test methods for components and parts used in electronic assemblies— 36 стр.
BS EN 60539-2. Directly heated negative temperature coefficient thermistors. Part 2. Sectional specification. Surface mount negative temperature coefficient thermistors— 24 стр.
BS IEC 61189-5-601. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-601. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards— 34 стр.
BS EN IEC 62025-2. High frequency inductive components. Non-electrical characteristics and measuring methods. Part 2. Test methods for non-electrical characteristics— 28 стр.
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies— 50 стр.
Fixed resistors for use in electronic equipment. Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G— 48 стр.
Environmental testing. Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste— 40 стр.
Fixed capacitors for use in electronic equipment -- Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 (IEC 60384-21:2019) (english version)
Fixed electric double-layer capacitors for use in electric and electronic equipment -- Part 1: Generic specification (IEC 62391-1:2015) (english version)
Fixed capacitors for use in electronic equipment -- Part 18: Sectional specification - Fixed aluminium electrolytic surface mount capacitors with solid (MnO2) and non-solid electrolyte ( IEC 60384-18:2016) (english version)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016) (english version)
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 53 стр.
