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IEC 60068-2-69:1995 ed1.0

Заменен
Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method — 22 стр.
Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.
ICS
19.040 Environmental. Including testing equipment / Климатические испытания. Включая испытательное оборудование