Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 42 стр.
Environmental testing. Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method— 58 стр.
Environmental testing. Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 46 стр.
Fixed capacitors for use in electronic equipment - Part 17: Sectional specification - Fixed metallized polypropylene film dielectric AC and pulse capacitors (IEC 60384-17:2019); German version EN IEC 60384-17:2019— 47 стр.
