Corrigendum 1 - Amendment 2 - Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits— 2 стр.
Amendment 2 - Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits— 7 стр.
Amendment 1 - Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits— 5 стр.
Fibre optic active components and devices - Package and interface standards - Part 18: 40-Gbit/s serial transmitter and receiver components for use with the LC connector (IEC 62148-18:2014); German version EN 62148-18:2015— 34 стр.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 42 стр.
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms (IEC 60286-4:2013) (english version)
Corrigendum 1 - Amendment 2 - Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits— 2 стр.
Amendment 2 - Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits— 7 стр.
Amendment 1 - Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits— 5 стр.
