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IEC 60191-5:1997 ed2.0

Действует
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB) — 71 стр.
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
ICS
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом