Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON— 24 стр.
IEC 60191-6-10:2003 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (hereinafter called P-VSON).
ICS
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом
