Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)— 36 стр.
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)— 29 стр.
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018— 41 стр.
Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance (IEC 62148-1:2017); German version EN IEC 62148-1:2018— 13 стр.
Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages (IEC 62148-15:2014); German version EN 62148-15:2014— 23 стр.
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)— 29 стр.
