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IEC 60191-6-4:2003 ed1.0

Действует
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) — 32 стр.
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
ICS
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом