Mechanical standardization of semiconductor devices. Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 19 стр.
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 39 стр.
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 39 стр.
Low-frequency cables and wires with PVC insulation and PVC sheath. Part 5: Equipment wires and cables with solid or stranded conductors, PVC insulated, screened, single or one pair— 29 стр.
