Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 39 стр.
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 76 стр.
Mechanical standardization of semiconductor devices. Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 19 стр.
Amendment 1 - Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 20 стр.
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 76 стр.
Mechanical standardization of semiconductor devices. Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 19 стр.
Amendment 1 - Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 20 стр.