Harmonized system of quality assessment for electronic components. Sectional specification: capability approval of manufacturers of printed board assemblies of assessed quality— 70 стр.
Harmonized system of quality assessment for electronic components. Detail specification. Two-part connectors for printed boards for high number of contacts with basic grid of 2,54 mm on 3 or 4 rows— 62 стр.
Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly— 20 стр.
Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly— 20 стр.
Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly— 20 стр.
Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly— 20 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling— 18 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz)— 26 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Measurement of melting temperature or melting temperature ranges of solder alloys— 18 стр.
Connectors for frequencies below 3 MHz for use with printed boards. Two-part connectors for printed boards, backpanels and cable connectors, basic grid of 2,54 mm (0,1 in)— 70 стр.
Connectors for frequencies below 3 MHz for use with printed boards. Two-part connectors for printed boards for basic grid of 2,54 mm (0,1 in), inverted type— 36 стр.
Materials for printed boards and other interconnecting structures. Copper-clad laminates for flexible boards (adhesive and non-adhesive types)— 34 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines— 26 стр.
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 40 стр.
Test methods for electrical materials, printed board and other interconnection structures and assemblies. General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards— 28 стр.
Connectors for frequencies below 3 MHz for use with printed boards. Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features— 86 стр.
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 42 стр.
Insulation coordination for equipment within low-voltage systems. Application guide. Explanation of the application of the IEC 60664 series, dimensioning examples and dielectric testing— 68 стр.
Printed board assembly products. Manufacturing description data and transfer methodology. Sectional requirements for implementation of printed board fabrication data description— 48 стр.
Test methods for electrical materials, printed board and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning— 12 стр.
BS EN 61189-2-804. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-804. Test methods for time to delamination. T260, T288, T300— 9 стр.
BS EN IEC 61189-2-803. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-803. Test methods for Z-Axis Expansion of base materials and printed board— 9 стр.
Environmental testing. Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 46 стр.
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies— 50 стр.
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies— 50 стр.
Environmental testing. Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste— 40 стр.
Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plated through holes— 32 стр.
Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections— 30 стр.
Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections— 34 стр.
Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes— 26 стр.
System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections— 34 стр.