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СтандартыIEC

IEC 60249-2-11:1987 ed1.0

Отменен
Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards — 17 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 60249-2C:1973/AMD1:1978 ed1.0
Заменен
Amendment 1 - Metal-clad base materials for printed circuits - Part 2: Specifications — 2 стр.
IEC 60249-2C:1973/AMD2:1979 ed1.0
Заменен
Amendment 2 - Metal-clad base materials for printed circuits - Part 2: Specifications — 1 стр.
IEC 60249-2C:1973 ed1.0
Заменен
Third supplement - Metal-clad base materials for printed circuits - Part 2: Specifications — 11 стр.

На этот документ ссылаются

BS 123600-003:2001
Действует
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections — 26 стр.
BS 123300-003:2001
Действует
System of quality assessment. Capability detail specification. Rigid multilayer printed boards — 42 стр.
BS 123700-003:2001
Действует
System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections — 26 стр.
IEC 60249-2C:1973/AMD1:1978 ed1.0
Заменен
Amendment 1 - Metal-clad base materials for printed circuits - Part 2: Specifications — 2 стр.
IEC 60249-2C:1973/AMD2:1979 ed1.0
Заменен
Amendment 2 - Metal-clad base materials for printed circuits - Part 2: Specifications — 1 стр.
IEC 60249-2C:1973 ed1.0
Заменен
Third supplement - Metal-clad base materials for printed circuits - Part 2: Specifications — 11 стр.